Ndị nwere nkà na-apụta site n'ọgbọ ruo n'ọgbọ, nke ọ bụla na-eduga n'ụzọ ruo ọtụtụ narị afọ.Enwere nnukwu injinia bụ onye duziri nyocha na mmepe nke chips Huawei HiSilicon, tọrọ ntọala maka ọganihu ngwa ngwa nke Huawei na mpaghara mgbawa, ma mee HiSilicon ibe ndị ama ama n'ụwa niile ma tinye ya n'ahịrị ngwaahịa dị iche iche.Ọ bụ onye bụbu onye isi ụkpụrụ ụlọ Huawei HiSilicon Semiconductor- David.
Iji kwalite ike R&D nke Lime nke ukwuu na ngalaba nkwukọrịta, ka ọ bụrụ onye isi n'ihu ụlọ ọrụ, na iduzi usoro ụlọ ọrụ, David, onye bụbu onye injinia Huawei nke ruru n'ọkwa, ewebata ya nke ọma dị ka ọkachamara netwọkụ anya Lmee.Njikọta nke David emewo ka nkà nka nka Lmee sikwuo ike, yana ndị a ma ama nwere ihe karịrị n 10 ahụmahụ R&D n'ọhịa nzikọrịta ozi, ike R&D zuru oke nke Lmee emeziwanyela, yanaXGSPON OLT, WIFI 6 AX3000 ONT,AX1800 rawụtana ngwaahịa ndị ọzọ na-ewu ewu ka ewepụtara nke ọma, mee ka Lime dị anya n'ihu ndị asọmpi ya.Anyị na-atụkwa anya na ọtụtụ ndị nwere echiche dị elu na ndị injinia magburu onwe ha ga-esonye n'òtù Laimi, iji mee ka ndị òtù Laimi sie ike, na-eme ka ndị ọzọ na-emekarị na ngwaahịa dị mma, na-emepụta ihe bara uru maka ndị ahịa.
ndabereIokwu mmalite:
2011-2018 Chief Software Architect nke Shenzhen Hisilicon Semiconductor Technology Co., Ltd.
Nna-ukwu nke ngwanrọ, afọ 16 nke ahụmịhe ọrụ na 500 kacha elu n'ụwa, ndị mmepe nwere ahụmahụ, ndị njikwa ọrụ mara mma, ndị injinia sistemu, ndị injinia sistemụ, ndị njikwa ngwaahịa, ndị na-ahụ maka ngwanrọ mgbawa, na CEO nke ụlọ ọrụ mmalite n'ọtụtụ R&D na ọnọdụ njikwa. .Soro na nyocha ụlọ ọrụ na mmepe nke IPD na mgbanwe usoro CMM.Ọkachamara n'asụsụ C, maara nke ọma na Linux, maara nke ọma na mmepe ngwaọrụ agbakwunyere, maara nke ọma na njikwa ọrụ IPD, ụdị mmepe ogo CMM, maara nke ọma na njikwa usoro ndụ ngwaahịa, maara nke ọma n'usoro sọftụwia sistemu ụkpụrụ ụlọ, maara nke ọma n'ịchọpụta ihe, ire ere na nkesa.
Oge nzipu: Jan-11-2023